Epoxy Siloxane Resins
Polyset is continuing to develop a family of novel siloxane-based monomers and oligomers that are especially attractive for such applications as microelectronics, photonics, composites, coatings and adhesives. These novel materials bear reactive functional groups consisting of cyclohexyl epoxy, glycidyl ether, vinyl ether and acrylate moieties as well as combinations of these groups. In the past, Polyset has also developed a series of proprietary curing agents that can be applied to these and other similar materials. Combination of the novel siloxane-based resins with these curing agents allows these materials to be cured thermally or using UV or e-beam irradiation. Dual thermal and radiation cure systems may also be employed.
|PC-1000||Difunctional Epoxy Terminated||Low shrinkage|
|PC-1035||Difunctional Epoxy Terminated||Higher MW than PC-1000, flexibizer|
|PC-2000||Multifunctional 20,000 g/mol resin||Fast cure speeds, high adhesion|
|PC-2004||Multifunctional 1.000 g/mol resin||Lower viscosity material suitable for inks|
|PC-2011||Aromatic-Epoxy Copolymer||Higher Temperature Resistance, RI|
|PC-2021||High EEW Copolymer||Low dielectric|
|PC-2026||Flouroalkyl-Epoxy Copolymer||Low RI|
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