PC-2509
DAI - SbF6, Solid Salt
Features: Non-Benzene Releasing
PC-2514
TAS - PF6, 50% Solution
Features: Heavy Metal-Free Anion
PC-2520
TAS - SbF6, Solid Salt
Features: Single Isomer Salt, Lower Photospeed Variability
PC-2544
DAI - SbF6, 40% Solution
Features: PC-2506 dissolved in cycloaliphatic epoxy
PC-1000
Monomer Product -Difunctional Epoxy Terminated
Features: Low shrinkage
PC-2000
Oligomer Product - Multifunctional 20,000 g/mol resin
Features: Fast cure speeds, high adhesion
PC-2004
Oligomer Product - Multifunctional 1.000 g/mol resin
Features: Lower viscosity material suitable for inks
PC-2011
Oligomer Product - Aromatic-Epoxy Copolymer
Features: Higher Temperature Resistance, RI
PC-2505
TAS - SbF6, 50% Solution
Features: Especially Sensitive for i-line applications
PC-2506
DAI - SbF6, Solid Salt
Features: Fast Cure Speeds
PC-2508
DAI - PF6, Solid Salt
Features: Heavy Metal-Free Anion