Polyset has developed a set of materials that are ideal for use in next generation on-wafer/on-package microelectronic applications. These materials exhibit a variety of strengths including:

• Low dielectric
• High Adhesion
• High Strength/Modulus
• Photo definability (via UV or EB)

These materials have been optimized for applications including:

• Interlayer dielectric (ILD)
• Copper diffusion barriers
• CMP Stop materials
• 3-D wafer bonding adhesives

To get more detail about these and more unique solutions from Polyset, click here