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Products Advanced Materials - Epoxy Siloxane Resins

Polyset is continuing to develop a family of novel siloxane-based monomers and oligomers that are especially attractive for such applications as microelectronics, photonics, composites, coatings and adhesives. These novel materials bear reactive functional groups consisting of cyclohexyl epoxy, glycidyl ether, vinyl ether and acrylate moieties as well as combinations of these groups. In the past, Polyset has also developed a series of proprietary curing agents that can be applied to these and other similar materials. Combination of the novel siloxane-based resins with these curing agents allows these materials to be cured thermally or using UV or ebeam irradiation. Dual thermal and radiation cure systems may also be employed.  
 
  

Monomer Product #

Description

Features

PC-1000

Difunctional

Epoxy Terminated

Low shrinkage

PC-1001

Monofunctional

Epoxy Terminated

Reactive diluent

for ink formulations

PC-1002

Difunctional

Vinyl Terminated

Fastest cure speeds available

PC-1035

Difunctional

Epoxy Terminated

Higher MW than

PC-1000, flexiblizer

Oligomer Product #

Description

Features

PC-2000

Multifunctional  20,000 g/mol resin

Fast cure speeds,  high adhesion

PC-2004

Multifunctional 1.000 g/mol resin

Lower viscosity material suitable for inks

PC-2011

Aromatic-Epoxy Copolymer

Higher Temperature Resistance, RI

PC-2021

High EEW  Copolymer

Low dielectric

PC-2026

Fluoroalkyl-Epoxy Copolymer

Low RI

 
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